Applied Materials announced the collaboration on October 6, calling Intel a founding partner of the EPIC (Equipment and Process Innovation and Commercialization) Center. Teams will work on next-generation materials, process technologies and device architectures for advanced logic nodes targeting AI workloads, plus advanced packaging for Intel’s Foveros 3D stacking to support higher interconnect density, improved power delivery and thermal performance for high-performance compute platforms built for agentic AI. Financial terms were not disclosed.
“Bringing our teams together at the EPIC Center will deepen that partnership and accelerate the transistor, interconnect and packaging innovations needed to drive the future of AI computing,” said Applied CEO Gary Dickerson. Intel CEO Lip-Bu Tan said the company is “focused on delivering those innovations and doing it in close collaboration with partners across the ecosystem.” The center, scheduled to be operationally ready in 2026, gives chipmakers earlier access to Applied’s R&D portfolio and faster transfer of next-generation technologies into high-volume manufacturing.