GlobalFoundries will produce silicon interposers for TSMC’s chip-on-wafer-on-substrate (CoWoS) advanced packaging specification at its Malta, New York fab site, under a multi-year deal expected to last five years with an option to extend. The interposers sit under compute logic and memory in multi-die assemblies such as GPUs and AI accelerators, providing faster, lower-power communication between chips than conventional organic packaging.
The timing matters. When TSMC began producing Nvidia’s Blackwell GPUs in Arizona, the final product still had to be round tripped to Taiwan for final assembly, and neither TSMC’s own Arizona packaging facility nor Amkor’s US CoWoS services are expected online until 2028 or 2029. GlobalFoundries plans to add capacity at Malta to meet demand, but volume production will not begin until the first half of 2028 at the earliest.