TSMC weighs making 3D DRAM at Nvidia's request

TSMC has begun drawing up plans to manufacture 3D DRAM after a request from Nvidia, its largest customer, according to a report by The Information carried by Reuters on Friday.

Why it matters: Making memory cells would take the world's largest contract chipmaker beyond logic chips into a market held by Samsung, SK hynix and Micron, at a moment when AI demand is straining memory supply.

Data as of The Information report of November 6, 2026, as carried by Reuters and read in full via MarketSpeaker's account on November 6, 2026. Single-origin reporting: neither TSMC nor Nvidia had responded to Reuters' requests for comment, no timetable, investment or capacity figure has been disclosed, and TSMC's stated position is that it does not comment on market rumours and remains focused on its core foundry business. Developing item.

Nvidia has asked TSMC to explore producing 3D DRAM, a form of memory that builds its storage cells in vertical layers, and TSMC has begun drafting plans in response, The Information reported on Friday, in an account carried by Reuters. The work is said to be led by Hsu Kuo-chin, the TSMC vice president responsible for advanced packaging technology development, who previously worked at Micron.

TSMC is weighing two routes to capacity, building new factories for memory production or acquiring an existing plant and converting it, Reuters reported. No production timetable, investment figure or capacity target has been disclosed, and neither company responded to the news agency’s requests for comment.

TSMC weighs making 3D DRAM at Nvidia's request

Sources