Samsung Electro-Mechanics to invest 4.3 trillion won in Sejong

Samsung Electro-Mechanics announced on Thursday a 4.3 trillion won investment in its Sejong plant to expand production of FC-BGA package substrates for AI servers and high-performance computing, with full-scale mass production targeted for around September 2028.

Why it matters: Package substrates are a binding link between AI chips and mainboards, and Sejong City said the spend is the first stage of a total plan in the region of 8 trillion won the company has been reviewing.

Data as of Yonhap News Agency report of November 12, 2026, in Korean, read in full via the estate browser route and translated. Single source: no second outlet had reported the Sejong plan as of this run, and the article gives no jobs figure and no subsidy or grant figure. Developing item.

Samsung Electro-Mechanics announced a 4.3 trillion won investment in its Sejong plant on Thursday, at the Chungcheong Mega Project groundbreaking ceremony in Asan. The company will build a new four-storey factory near its existing plant in the Myeonghak Industrial Complex to expand production facilities for high-performance package substrates, the FC-BGA boards that connect AI server and high-performance computing chips to the mainboard.

Sejong City said the spend is the first stage of a total investment plan in the region of 8 trillion won that the company had been reviewing, following the Chungcheong advanced-industry investment plan announced in July. The company aims to shorten construction to meet global IT companies’ demand for rapid mass production, targeting full-scale production around September 2028. Mayor Cho Sang-ho promised prompt administrative support; the article stated no subsidy figure and no jobs count.

Samsung Electro-Mechanics to invest 4.3 trillion won in Sejong

Sources